MID-LDS
MID is the abbreviation for Moulded Interconnect Device
The goal of MID Technology is to unite electrical and mechanical functions in a single construction unit. The circuit tracks can be integrated into the component housing as a substitute for a conventional printed circuit board. As a result, weight and fitting space can be effectively reduced.
LDS technology (Laser Directed Structuring)
The three-dimensional circuit carrier is injection moulded from a modified polymer material. The modification allows laser activation of circuit tracks on the surface of the circuit carrier. The activated areas become metalized in a chemical metalzation bath in order to build conductive tracks.
(product surface 20x enlarged)
LDS process
More flexibility because the laser directly transfers the artwork from the computer to the injection-moulded component, so no additional tools or masks are required.
Structuring takes place solely on the basis of the existing CAD data. Tooling costs significantly reduced because laser-structurable MIDs can be made using 1-component injection moulding.
Lasers are ideal for the production of ultra-fine structures. High cost efficiency for fine structures and small to medium production runs in particular. Highly pro-environment because no caustic or etching chemicals are used.
Material Selection
A number of series materials or thermoplastics are available to produce injection-moulded MIDs for the LDS method:
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PA6/6T
- PBT, PET
- LCP
- PC/ABS
Valukumpu has capability to make reflow soldering, wirebondable and antenna surfaces.
Laser tracks
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Minimum track width: 150 μm
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Minimum gap: 200 μm
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Laser area: 160 x 160 mm
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